Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD45.99
USD76.99

Pay in 4 interest-free payments of $11.50 Learn more

Field rating
4.3

Verified studio score · Spec revision current

Fit · Size

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Energy: 60S/120S/180S≈600J/1200J/2000J

SKU: 71209036118

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 1 - Sep 6

Description

Energy: 60S/120S/180S≈600J/1200J/2000J

color correction and other functions

welding and send tin integration efforts temperature can be set between 200-500 degrees from the thermostat can be quickly replaced and automatically welded tin

the optical laser separation machine is not able to remove the glue on the broken place when it separates the back glass cover if the glass is very smashed

SEQURE S99 soldering iron supports PD/QC/DC/PPS power supply

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Energy: 60S/120S/180S≈600J/1200J/2000JYCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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