MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Option 3: For iPhone X-11

Option 3: For iPhone X-11 pro max Pre-Heating groove

can be connected to mobile phone and computer

Compatibility: For iPhone 12 Pro

5 Convex Cross/Phillips 1

1x 144 Led light

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Option 3: For iPhone X-11MECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated